Product SKUs
MBD-H11DSi-B 
     
  • H11DSi (Bulk Pack)
    •  

MBD-H11DSi-O 
     
  • H11DSi (Retail Pack)
    •  

              
 
Physical Stats
Form Factor 
    
  • E-ATX
    • 

Dimensions 
    
  • 12" x 13.05" (30.5cm x 33.1cm)
    • 

              
 
Processor/Chipset
 
CPU 
    
  • Dual AMD EPYC™ 7000-series Processors
    • 
  • Socket SP3
    • 

Chipset 
    
  • System on Chip
    • 

                         
 
System Memory
Memory Capacity 
    
  • 16 DIMM sockets
    • 
  • Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs
    •  
  • 8-channel memory bus
    • 
  • For Dual CPUs: Recommended that memory be populated equally in adjacent memory banks
    •  
  • See Detailed Memory Support Matrix
    • 

Memory Type 
    
  • DDR4 2666 MHz Registered ECC, 288-pin gold-plated DIMMs
    • 

DIMM Sizes 
    
  • 8GB, 16GB, 32GB, 64GB, 128GB
    • 

Memory Voltage 
    
  • 1.2V
    • 

Error Detection 
    
  • Corrects single-bit errors
    • 
  • Detects double-bit errors (using ECC memory)
    • 

                        
 
On-Board Devices
SATA 
    
  • SATA3 (6 Gbps)
    • 

IPMI 
    
  • Support for Intelligent Platform Management Interface v.2.0
    • 
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
    • 
  • ASPEED AST2500 BMC
    • 

Network Controllers 
    
  • 2 1GbE LAN via Intel® i350-AM21
    • 
  • 1 Realtek RTL8211E PHY (dedicated IPMI)
    • 

VGA 
    
  • ASPEED AST2500 BMC
    • 

                              
 
Input / Output
SATA 
    
  • 10 SATA3 (6 Gbps) ports
    • 

LAN 
    
  • 2 RJ45 Gigabit Ethernet LAN ports
    • 
  • 1 RJ45 Dedicated IPMI LAN port
    • 

USB 
    
  • 2 USB 3.0 ports (rear)
    • 
  • 4 USB 2.0 ports (2 rear + 2 via header)
    • 

VGA 
    
  • 1 VGA port
    • 

Others 
    
  • 1 COM port (rear)
    • 
  • 2 SATA DOM power connector 
    • 
  • 1 TPM 2.0 header
    • 

                
 
Expansion Slots
PCI-Express 
    
  • 3 PCI-E 3.0 x8 
    • 
  • 2 PCI-E 3.0 x16 
    • 

M.2 
    
  • Interface: PCI-E 3.0 x2 
    • 
  • Form factor: 22110 
    • 
  • Support SATA devices 
    • 

		                  
Chassis ( Optimized for H11DSi )
4U Chassis 
    
  • CSE-745BAC-R1K28B2
    • 

             
 
System BIOS
BIOS Type 
    
  • AMI 128Mb SPI Flash EEPROM
    • 

BIOS Features 
    
  • Plug and Play (PnP)
    •  
  • DMI 2.3
    • 
  • PCI 2.2
    • 
  • ACPI 5.1
    • 
  • USB Keyboard Support
    • 
  • SMBIOS 3.1.1
    • 

              
 
Management
Software 
    
  • Super Doctor 5
    • 
  • Watch Dog
    • 
  • NMI
    • 
  • SPM
    • 
  • SUM
    • 
  • IPMI 2.0, KVM with dedicated LAN
    • 

Power Configurations 
    
  • ACPI Power Management
    • 
  • Power-on mode control for AC power loss recovery
    • 

                          
 
PC Health Monitoring
CPU 
    
  • Monitors CPU Core Voltages, +1.5V, +1.8V, +12V +5V, +5V standby
    • 
  • CPU switching voltage regulator
    • 
  • Supports system management utility
    • 
  • VBAT
    • 

FAN 
    
  • Up to 8-fan status tachometer monitoring
    • 
  • Up to eight 4-pin fan headers
    • 
  • Dual Cooling Zone
    • 
  • Status monitor for speed control
    • 
  • Pulse Width Modulated (PWM) fan connectors
    •  

Temperature 
    
  • Monitoring for CPU and chassis environment
    • 
  • CPU Thermal Trip Support
    • 
  • Thermal control for 8x Fan connectors
    • 
  • I2C Temperature Sensing Logic
    • 

LED 
    
  • CPU / System Overheat LED
    •  

Other Features 
    
  • Chassis Intrusion Detection
    • 
  • Chassis Intrusion Header
    • 
  • UID
    • 

 
 
Operating Environment / Compliance
Environmental Specifications
  • Operating Temperature:
       10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)